MTIC 2027. ALL RIGHTS RESERVED.

The 2027 International Symposium on Memory Technology and Integrated Circuits (MTIC 2027) is co-organized by Anhui University and the IEEE Circuits and Systems Society (IEEE CASS) Hefei Chapter, hosted by the School of Integrated Circuits, Anhui University, and supported by the Anhui Province Integrated Circuit Talent Cultivation Alliance. The symposium will take place from October 15 to 17, 2027, at Anhui University, under the theme “Innovative Applications of Memory Design and Intelligent Circuit Systems,” with the aim of building a high-level academic exchange platform with international influence.

Currently, memory technology, as a core pillar of the integrated circuit industry, faces multiple challenges including advanced process scaling, power consumption control, reliability improvement, and novel memory architectures. At the same time, emerging applications such as artificial intelligence and the Internet of Things impose increasingly stringent requirements on the functionality and energy efficiency of intelligent circuit systems. Against this backdrop, MTIC 2027 is dedicated to gathering global academic and industrial expertise, promoting the cross-disciplinary integration of memory design and integrated circuits, and accelerating original innovation and engineering translation.

The conference will invite renowned academicians and leading experts from around the world to deliver keynote speeches, and will feature multiple technical sessions with oral and poster presentations. The topics of interest cover memory devices and processes, memory circuits and architectures, digital and analog integrated circuit design, 3D integration and advanced packaging, as well as design automation and testing of integrated circuits. Accepted papers will be submitted for inclusion in IEEE Xplore and indexed by EI Compendex and Scopus.

MTIC 2027 cordially invites experts, scholars, researchers, and engineers worldwide to submit papers, share original research findings and technological breakthroughs, and jointly promote the advancement and industrial upgrading of memory technology and integrated circuit disciplines.